- FE modeling of sequential machining processes in 2D, transfer component conditions, linking to adjacent sub processes 
 
- Determination of the surface layer condition with small element edge sizes and remeshing for realization of material separation 
 
- Numerical study of the influences of process parameters and initial conditions of the component 
 
- Development of a forecasting model to describe the component condition after chip removal process done by broaching
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- Residual stress state depends on process parameters as well as on the number of sequential cuts 
 
- With increasing number of cuts: change of surface residual stresses, as well as deeper tensile residual stresses for simultaneously decreasing cutting velocity and increasing uncut chip thickness 
 
- Development of a steady state in the surface layer after a higher number of sequential cuts
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